Suggestions for thermal design of NB modules?

Last Updated on：2023-01-30 09:45:32

The module will generate heat during operation and may also be affected by other high-temperature components. The heat dissipation is considered during the design of this product. When connecting to the system board, please keep the ground thermal pad well grounded. This is of great help to heat conduction and thermal balance, as well as to the electrical performance of the whole machine.

Remarks: Try to keep this module product away from the power supply and high-speed signal lines, and protect the wiring of these interference sources. The antenna and the coaxial cable connecting the network card and the antenna should not be placed close to these interference sources. Do not place the module close to components with large heat generation such as CPU, as temperature rise will affect the RF performance.